Precision Engineered Products, Systems and Services
Merritt Precision Technology, Inc.
Distribution Partners
InnoLas Semiconductor Gmbh.
Since 1998, Merritt Precision Technology, Inc. has been the North American Sales and Service center for InnoLas Semiconducotr Gmbh. InnoLas is a worldwide leading provider of Wafer Marking and Wafer Sorting equipment.
Wafer Markers
The InnoLas wafer marking systems are specially designed to mark semiconductor wafers with an individual code. This process serves to ensure the traceability of each individual wafer throughout the entire manufacturing process. In order to always obtain a homogeneous and clean marking process on a wide variety of materials, we use a laser specially developed for marking on semiconductor materials. This, in combination with the optimal optical setup, guarantees high quality marking and also prevents any negative influence on subsequent processes. A variety of fonts used in the semiconductor industry, such as SEMI OCR, SEMI T7 Data Matrix, Barcode 412 and “Engraved Mode” can be lasered onto the wafers in a recipe-controlled manner. Of course, the SEMI specifications applied for this purpose are taken into account. Excellent and reliable readability with commercially available reading systems is another feature of our marking processes, which are subject to continuous further development.
Wafer Sorters
InnoLas Semiconductor, GmbH offers wafer sorting equipment specializing in sorting by:
The marked ID-Code is read by a camera system. After that process step the wafer is automatically placed according the wafer ID in the cassette. There are following sorting modes:
- Ascending/Descending Order
- Split of Wafers
- Merge of Wafers
- Randomization of Wafers
- Individual Sorting by Host Control
The weight of a wafer is measured by a precise scale (+/-0,0001 gramms). This help customers to adjust following processes such as etching correctly.
The wafers will be sorted according to their weight either ascending, descending or randomized.
The thickness of a wafer is measured by high precise thickness measurement sensors to adjust following process steps corretly. Furthermore this feature can be used to check if the right material is in a certain cassette.
The wafers can be autmatically sorted by their thickness ascending, descending or randomized.